Used for evaluating defects at the grain structure level. For example, the interface of plated acid copper to the n-1 capture pad of a blind via. It can also be used to evaluate and identify inter-metallic structures. It offers both high-resolution imaging and flexible micro-machining in one single platform. This test is used to create very precise cross-sections of a sample for subsequent imaging.
Large Photo (Left): 3000X of a section of the nickel plating post ion milling – note this section does not have all of the final nickel plating present.
Smaller Photos (Right): Shows F.I.B. Cuts