Rework Simulation

We test to IPC TM 650 2.4.36C or customer specific protocols.

This test method is used to simulate the procedures for plated-through hole (PTH) component removal and replacement, in order to determine the effects of rework on the quality and integrity of the PTH barrel and conductor foil on bare rigid or flexible printed boards. There are five steps that are designed to simulate initial soldering after a preconditioning bake and two subsequent replacements.