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SURFACE TENSIONS FOR POPULAR FLUXES          

 We will keep this table updated as we test new fluxes.

If you would like a Flux tested please contact us. There is no charge for our existing customers for this service..

Please contact us if you have a question or would like to add a flux to this list.

How to make a Test Coupon

1)       The routed edge of the test coupon MUST expose copper.

2)       The surface finish should be applied prior to routing, exposing the copper edge is not a problem.

3)       The coupon can be manufactured with or without solder mask.

4)       Thickness of the material is not critical but it is recommended to be 0.028”, 0.062” or 0.093”

5)       Always acid copper plate the coupon prior to surface finish application.

6)       If manufactured in panel format score coupons prior to routing them into strips.

7)       It is not necessary to drill/plate the though holes on the coupon. Testing will be on the SMD pads only.

8)       If desired the 6 pads of 3mmX 3mm can be replaced by 12 pads of 1.5mm X 3mm, (note the height is more critical than the width)

25.4mm

 Please Contact us if you would like Gerber Data for the Above Coupon.

How to Make a Test Coupon from an Existing Circuit Board

PAPERS

We have an evergreen list of Technical papers. The contain valuable data however they are large files.

If you would like a copy of any article please contact us and we will be glad to send you an e-mail or CD-ROM.

List of Papers.

• An examination of the shelf life of five solderable coatings in real time using a wetting balance: HASL (hot air solder leveled), Organic,   ENIG
• (Electroless Nickel Immersion Gold), Electroless Palladium and Immersion Silver.
• Effect of Co Deposition of Phosphorous in Nickel on solderability as a function of Nickel Bath Age in the ENIG ( Electroless Nickel Immersion Gold) process.
• An overview of Processes and Solderability performance of HASL alternatives.
• Standard Developments: efforts of ENIG ( Electroless Nickel Immersion Gold) IPC-4552.

    ARTICLES FROM Lead Free Components Group.

• FOCUS group evaluation: Status Report 1.
• Tin Whisker Studies
• Moisture Sensitivity Levels
• Thermal Cycle Test Vehicles
• Solderability results of Lead free terminations using the most common industry standard Techniques.
• Solderability of three surface finishes evaluated; HASL, ENIG and OSP (Organic Solderability Preservative)

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