We test to the IPC JSTD 002 and 003 standard and customer specific protocols.

 

Company President, Gerard O’Brien is Chairman of the 003 committee and an active member of the 002 committee.

 

Solderability testing is mainly performed using a Wetting Balance since this is the only method with an acceptable GR&R.

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We do offer dip and look testing, solder float, re-flow simulation either with pass/fail certs or a full report. Testing can be as received or post stressing (Steam, temp humidity, dry bake, or reflow simulation). We can also test with a variety of alloys and fluxes.

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The latest revision of JSTD 003 (Rev D) allows for partial immersion testing of standard coupons. Partial immersion testing demonstrates if the surface finish can support active wetting IE the solder advances further than the immersion depth. This can be used to evaluate the overall quality of soldering, the further the advancement of the solder the better the wetting. This provides significant more information to the user compared to a complete immersion test. Please review our video on correct partial immersion testing on a M coupon. 

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